Desk Top Magnetron Sputtering System, Magnetron sputtering coating system

Magnetron sputtering is a kind of physical vapor deposition, which is used to prepare films of metals, semiconductors, insulators and other materials. In the magnetron sputtering coating, the target material consumption and the target base distance increase with the increase of using times. When other parameters remain unchanged, the coating will not meet the requirements gradually. The uniformity of the magnetic field affects the uniformity of the film. If the magnetic field is asymmetric, the position of the coating will be shifted.

A multifunctional magnetron sputtering coating system is provided. The system is composed of a vacuum coating system and a vacuum glove box system, which can complete film evaporation in a high vacuum evaporation chamber, store and prepare samples in the glove box with high purity inert gas atmosphere and detect the samples after evaporation. The combination of evaporation coating and glove box can realize the full closed production of evaporation, packaging, testing and other processes, so that the whole process of film growth and device preparation is highly integrated in a complete controllable environmental atmosphere system, eliminating the influence of unstable factors in the atmospheric environment during the preparation of organic large-area circuits, and ensuring the preparation of high-performance, large-area organic optoelectronic devices and circuits.

The main purpose of the multi-function magnetron sputtering coating system is to prepare various metal films, semiconductor films, dielectric films, magnetron films, optical films, superconducting films, sensing films and functional films with special requirements.

A small magnetron sputtering coating instrument, which is characterized by its small size, It is used to deposit all kinds of metal and compound functional films on the surface of the Max.100mm wafer substrate.

Equipped with ONE 2-inch magnetron cathodes, it can be sputtered separately or two targets.

The sputtering modes include DC magnetron sputtering, DC reactive sputtering and RF magnetron sputtering. The process operation of the equipment is automatically controlled through the touch screen interface.

Vacuum Chamber: Dia300mm,Material is 304 stainless steel;

Turbo Molecular Pump: 600L/S,CF150

2-inch magnetron cathode

Magnetic target baffle

DC power supply:1KW

RF power supply: 600W

Substrate rotating table, substrate 4 inch Maximum

Substrate heating system: 400℃ Maximum

Air circuit solenoid isolation valve

Mass Flowmeter,Ar, N2/02

Cooling water separator

Electric Control System:Touch screen, control software

Rotating substrate table: substrate heating: room temperature ~ 400 ℃ ± 1 ℃, PID control.

Rotation speed: 0-30rpm, continuously adjustable.

Vacuum degree: limit vacuum degree: less than 5X10-4Pa

Magnetron sputtering power supply: 1 X1000w DC power supply, 1X600w RF power supply

Sputtering vacuum chamber: system reaction chamber: Dia300XH300 (subject to the actual design), the rear part is connected with the transfer chamber, and there is a DG150 flange interface on the side to install the turbo molecular pump air extraction system.